Telecamere CCD XIMEA GMBH
Disponiamo di un ampio parco di telecamere CCD e CMOS del produttore tedesco Ximea GMBH. Queste telecamere vengono spesso utilizzate per la visualizzazione di target che ad occhio nudo non potrebbero essere visti se il segnale è troppo debole o semplicemente per visualizzare e registrare un’immagine digitale sia in ambito Industriale che di Ricerca.
Le applicazioni dove le Imaging CCD vengono più spesso utilizzate sono la Microscopia ottica, la Biologia, la Patologia, la Genetica, la Biotecnologia, la Endomedicina, l’Ispezione, lo studio di Semiconduttori, il controllo Industriale, l’Automotive, processi indotti da Laser, e molte altre ancora. Data la varietà di applicazioni e la conseguente varietà di CCD prodotte, elenchiamo di seguito solo quelle più rappresentative. Vi invitiamo comunque a contattarci per avere dei suggerimenti sulla miglior scelta relativa alla Vostra applicazione.
CCD XIMEA GMBH SERIE X
| SERIE XiB | SERIE XiC | SERIE XiD | SERIE XiQ | |
|---|---|---|---|---|
| Sensore (Massima Rsoluzione) | 7.920 x 6.004 (30 fps) | 4.112 x 3.008 (31 fps) | 4.242 x 2.830 (15.3 fps) | 2.048 x 2.048 (170 fps) |
| Frame rate (Massime performance) | 3.500 fps (1280×864 ) | 165 fps (1936×1216 ) | 57 fps (1934×1456 ) | 500 fps (648×488 ) |
| Dimensioni | 60 x 60 x 38 mm | 26.4 x 26.4 x 33 mm | 60 x 60 x 39 mm | 26.4 x 26.4 x 26.5 mm |
| Peso | 175 grammi | 38 grammi | 320 grammi | 27 grammi |
| Interfaccia | PCI Express | USB 3.0 | USB 3.0 | USB 3.0 |
Applicazioni
ELENCO APPLICAZIONI
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ESEMPI APPLICATIVI
Eclissi solare acquisita con telecamere Ximea (Estate 2017).
Una telecamera miniaturizza Ximea è ideale per essere nascosta in infrastrutture dedicate alla sorveglianza e sicurezza.
Nuova applicazione per dentisti realizzata con Novocam Ltd.
Il Robot iCub impara a navigare tramite un sistema di visione ideato da CURRERA-R e Ximea GMBH.
Sistema di visione Embedded per l’ osservazione di panorami a 360°.
Sistema di ispezione di Metalli.
SERIE XIB
Le telecamere della serie XiB sono CMOS con interfaccia PCI, alta risoluzione ed elevati frame rate. Le caratteristiche principali sono:
- CMOS Veloci: La più alta velocità di acquisizione se utlizzate con le massime potenzialità dell’ interfaccia PCI (PCIe x8 Gen3), disponibili con sensori 12 Mpix, 20 Mpix, 50 Mpix o dedicati all’ alto frame rate
- Readout: 7x più veloce della GigE, 17x della USB 3.0, più veloce anche di Camera Link HS o CoaXPress
- Lunghissime distanze di lavoro: Si possono utilizzare cavi fino a 300m
- Versatili e con piccole dimensioni: 60 x 60 x 36 mm, 160 grammi
- Raffreddamento intelligente: Bassi consumi inferiori ai 6 W ed una minima dissipazione con l’ aggiunta di ventole
- Compatibilità: La USB 3.0 supporta Windows 7 e 10, macOS, Linux, ARM e 30 librerie
- Connettività e sincronizzazione: Sono presenti input ed output isoltati otticamente
- Controllo delle ottiche: disponibilità di ottiche per il controllo remoto di fuoco, apertura e stabilizzazione dell’ immagine.
- Facilità di ottimizzazione: sono disponibili numerosi accessori per personalizzare il proprio setup, disponibili come Board level, anche con sensore ottimizzato per l’ infrarosso (NIR).
MODELLI MONOCROMATICI ED A COLORI XiB:
| B/W model | Sensor | Resolution | Pixel µm | ADC bits | FWC | Sensor Diagonal | Power Watt | DR dB | Frames per sec(1) |
| CB120MG-CM | CMOSIS CMV12000 | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB120CG-CM | CMOSIS CMV12000 | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB120RG-CM | CMOSIS CMV12000 NIR (2) | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB200MG-CM | CMOSIS CMV20000 | 5120 x 3840, 20 MP | 6.4 | 12 | 13500 | 41 mm | 6 W | 66 | 33 |
| CB200CG-CM | CMOSIS CMV20000 | 5120 x 3840, 20 MP | 6.4 | 12 | 13500 | 41 mm | 6 W | 66 | 33 |
| CB500MG-CM | CMOSIS CMV50000 | 7920 x 6004, 48 MP | 4.6 | 12 | 16000 | 45 mm | 9 W | 64 | 30, 26, 22 |
| CB500CG-CM | CMOSIS CMV50000 | 7920 x 6004, 48 MP | 4.6 | 12 | 16000 | 45 mm | 9 W | 64 | 30, 26, 22 |
(1) Full resolution at RAW 8 bits, 10 bits and 12 bits; Server computers with bigger PCIe TLP packet size can increase the throughput by additional 10%
(2) Near infrared (enhanced) version of the sensor. Not standard off-the-shelf product. Please contact XIMEA for price and MOQ discussion
CARATTERISTICHE COMUNI XiB
| Sensor technology | CMOS, Global shutter |
|---|---|
| Acquisition modes | Continuous, software trigger, hardware trigger |
| Partial image readout | ROI (region of interest) / AOI (area of interest), Skipping / Binning (only certain models) |
| Image data formats | 8, 10, 12 bit RAW pixel data (depends on the model) |
| SDK/API | programmable with C++ and C# |
| Color image processing* | Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS(Color management system) |
| Hot/blemish pixels correction* | On camera storage of up to 5000 pixel coordinates, host assisted correction |
| Auto adjustments* | Auto white balance, auto gain, auto exposure, HDR (High Dynamic Range) |
| Flat field corrections* | Coming soon. Host assisted pixel level shading and lens corrections |
| FPN correction | Fixed pattern noise correction on the side of the camera |
| Interface | PCI Express standard cable connector compliant to PCI Express External Cabling Specifications |
| General purpose I/O | 2x optoisolated input, 2x optoisolated output, 4 non-isolated input-outputs,4x LED software programmable |
| Signal conditioning* | Programmable debouncing time |
| Synchronization | Hardware trigger input, software trigger, exposure strobe output, busy output |
| Lens mount | Standard EF mount with Active Lens Control – focus, iris, image stabilization |
| Power requirements | 6 Watt, supplied via the power cable (depends on the model) |
| Dimensions | 60 x 60 x 38 mm (depends on the lens mount version) |
| Weight | 175 grams (depends on the model) |
| Environment | Operating 0°C to 50°C on housing, RH 80% noncondensing, -30°C to 60°C storage |
| Conformity | CE, FCC, RoHS, PCI Express External Cabling Specifications compliant |
| Operating systems | Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, macOS, ARM |
| Minimum host hardware | Intel i5 3.0GHz, +2GB RAM available physical memory, Motherboard with PCIe x4 Gen2 (or PCIe x8 Gen3) necessary for full throughput, compliance down to PCIe x1 Gen1 gives reduced throughput |
| Software support | xiAPI SDK, adapters and drivers for 30 various image processing Libraries |
| Firmware updates | Field firmware update through xiCOP.This feature is being developed and tested |
(*) Feature is available only when thecamera is in XIMEA API mode.
MODELLI MONOCROMATICI ED A COLORI XiB-64:
| B/W model | Sensor | Resolution | Pixel µm | ADC bits | FWC | Sensor Diagonal | Power Watt | DR dB | Frames per sec(1) |
| CB120MG-CM | CMOSIS CMV12000 | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB120CG-CM | CMOSIS CMV12000 | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB120RG-CM | CMOSIS CMV12000 NIR (2) | 4096 x 3072, 12 MP | 5.5 | 8,10,12 | 13500 | 28 mm | 8 W | 60 | 133, 103, 86 |
| CB200MG-CM | CMOSIS CMV20000 | 5120 x 3840, 20 MP | 6.4 | 12 | 13500 | 41 mm | 6 W | 66 | 33 |
| CB200CG-CM | CMOSIS CMV20000 | 5120 x 3840, 20 MP | 6.4 | 12 | 13500 | 41 mm | 6 W | 66 | 33 |
| CB500MG-CM | CMOSIS CMV50000 | 7920 x 6004, 48 MP | 4.6 | 12 | 16000 | 45 mm | 9 W | 64 | 30, 26, 22 |
| CB500CG-CM | CMOSIS CMV50000 | 7920 x 6004, 48 MP | 4.6 | 12 | 16000 | 45 mm | 9 W | 64 | 30, 26, 22 |
(1) Full resolution at RAW 8 bits, 10 bits and 12 bits; Server computers with bigger PCIe TLP packet size can increase the throughput by additional 10%
(2) Near infrared (enhanced) version of the sensor. Not standard off-the-shelf product. Please contact XIMEA for price and MOQ discussion
CARATTERISTICHE COMUNI Xib-64
| Sensor technology | CMOS, Global shutter |
|---|---|
| Acquisition modes | Continuous, software trigger, hardware trigger |
| Partial image readout | ROI (region of interest) / AOI (area of interest), Skipping / Binning (only certain models) |
| Image data formats | 8, 10, 12 bit RAW pixel data (depends on the model) |
| SDK/API | programmable with C++ and C# |
| Color image processing* | Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS |
| Hot/blemish pixels correction* | On camera storage of up to 5000 pixel coordinates, host assisted correction |
| Auto adjustments* | Auto white balance, auto gain, auto exposure, HDR (High Dynamic Range) |
| Flat field corrections* | Coming soon. Host assisted pixel level shading and lens corrections |
| FPN correction | Fixed pattern noise correction on the side of the camera |
| Interface | PCI Express standard cable connector compliant to PCI Express External Cabling Specifications |
| General purpose I/O | 2x optoisolated input, 2x optoisolated output, 4 non-isolated input-outputs, 4x LED software programmable |
| Signal conditioning* | Programmable debouncing time |
| Synchronization | Hardware trigger input, software trigger, exposure strobe output, busy output |
| Lens mount | Standard EF mount with Active Lens Control – focus, iris, image stabilization |
| Power requirements | 17 Watt, supplied via power cable |
| Dimensions | 70 x 60 x 55 mm (depends on the version) |
| Weight | 268 grams (depends on the version) |
| Environment | Operating 0°C to 50°C on housing, RH 80% noncondensing, -30°C to 60°C storage |
| Conformity | CE, FCC, RoHS, PCI Express External Cabling Specifications compliant |
| Operating systems | Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, macOS, ARM |
| Minimum host hardware | Intel i5 3.0GHz, +2GB RAM available physical memory, Motherboard with PCIe x4 Gen2 (or PCIe x8 Gen3) necessary for full throughput, compliance down to PCIe x1 Gen1 gives reduced throughput |
| Software support | xiAPI SDK, adapters and drivers for 30 various image processing Libraries |
| Firmware updates | Field firmware update through xiCOP. This feature is being developed and tested |
(*) Feature is available only when thecamera is in XIMEA API mode.
SERIE XIC
Le telecamere della serie XiC sono le più piccole telecamere CMOS costruite con i sensori Sony Pregius™ (26.4 x 26.4 x 33 mm e solo 38 grammi di peso). La connessione al PC è USB 3.1. Le caratteristiche principali sono:
- CMOS Veloci: Alto frame rate ad elevata risoluzione: da 165 fps @ 2.3 Mpix a 31 fps @ 12 Mpix
- Readout: 4x più veloce della GigE, 5x della Firewire e 10x della USB 2.0
- Precisione: Sensori di alta qualità Global Shutter con sensori Pregius™
- Raffreddamento intelligente: Bassi consumi inferiori ai 3 W ed una minima dissipazione
- Compatibilità: La USB 3.0 supporta Windows 7 e 10, macOS, Linux, ARM e 30 librerie
- Interfaccia standard per l’ industria: Connessione USB 3.1 al computer
- AIA standard: USB3 Vision standard compliant
- Software: Proprietario con capacità di binning e ROI – GenICam / GenTL ed altamente ottimizzati API / SDK per il processamento dell’ immagine
- Connettività e sincronizzazione: Sono presenti input ed output isoltati otticamente
- Facilità di ottimizzazione: sono disponibili numerosi accessori per personalizzare il proprio setup e diverse tipologie di formati, alcuni dei sensori utilizzati sono: IMX249, IMX265, IMX264, IMX267, IMX304
- Efficienza di costi: Eccellente rapporto qualità prezzo
MODELLI SONY CMOS:
| B/W model | Color model | Sensor | Resolution | Pixel µm | ADC bits | Frames per sec(1) | DR dB | Optical size | Power Watt |
| MC023MG-SY | MC023CG-SY | Sony IMX174 | 1936 x 1216 | 5.86 | 12/10 | 165 fps | 71.7 | 1/1.2″ | 2.4 |
|---|---|---|---|---|---|---|---|---|---|
| MC031MG-SY | MC031CG-SY | Sony IMX252 | 2064 x 1544 | 3.45 | 12/10/8 | 122 fps | 70.9 | 1/1.8″ | 2.75 |
| MC050MG-SY | MC050CG-SY | Sony IMX250 | 2464 x 2056 | 3.45 | 12/10/8 | 76 fps | 70.8 | 2/3″ | 2.85 |
| MC089MG-SY | MC089CG-SY | Sony IMX255 | 4112 x 2176 | 3.45 | 12/10/8 | 43 fps | 70.5 | 16.1 | 3.25 |
| MC124MG-SY | MC124CG-SY | Sony IMX253 | 4112 x 3008 | 3.45 | 12/10/8 | 31 fps | 70.4 | 17.6 | 3.25 |
(1) Maximum frame rates measured at 8 bits per pixel RAW data in free run mode. Please check faster versions available from xiX line based on PCIe interface All models are also available in Board level version with flat flex ribbon cable or with USB Type C connector on request: info@ximea.com
CARATTERISTICHE SONY CMOS
| Sensor technology | CMOS, Pregius™ technology |
|---|---|
| Acquisition modes | Continuous, software trigger, hardware trigger (Global Shutter) |
| Partial image readout | ROI / AOI (region/area of interest), Skipping and Binning modes supported (check manual for details) |
| Image data formats | 8, 10, 12 bit RAW pixel data |
| SDK/API | Programmable with C++ and C# |
| Color image processing | Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS, lookup table (LUT), hue, saturation, sharpness, white balance and more |
| Hot/blemish pixels correction | On camera storage of up to 5000 pixel coordinates, host assisted correction |
| Auto adjustments | Auto white balance, auto gain, auto exposure, HDR (High Dynamic range) |
| Flat field corrections | Host assisted pixel level shading and lens corrections. This feature is being developed and tested |
| Interface | USB 3.0 standard Micro B with screw lock threads compliant to USB3 Vision standard |
| General purpose I/O | 1x opto-isolated input, 1x opto-isolated output, 2 GPIO, 4x LED software programmable |
| Signal conditioning | Programmable debouncing time |
| Synchronization | Hardware trigger input, software triggering, exposure strobe output, busy output |
| Lens mount | Standard C mount. Adjustable into CS mount |
| Power requirements | 3 Watt, supplied via USB 3.0 interface |
| Dimensions | 26.4 x 26.4 x 33 mm (USB 3.0 Micro-B version) |
| Weight | 38 grams (Micro-B version) |
| Environment | Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage |
| Conformity | CE, FCC, RoHS, GenICam/GenTL, USB 3.1 Gen 1, USB3 Vision Compliant |
| Operating systems | Windows 7 SP1 (x86 and x64), and 10, Linux Ubuntu, ARM, macOS |
| Minimum host hardware | Intel i3 3.0GHz, +2GB RAM available physical memory, NVIDIA or Radeon 128MB, Motherboard with PCIe x1 Gen 2 slot, compatible USB 3.0 host adapter |
| Software support | xiAPI SDK, adapters and drivers for various image processing Libraries |
| Firmware updates | Field firmware update through xiCOP |
(*) Feature is available only when the camera is in XIMEA API mode.
DOWNLOAD:
SERIE XID
Le telecamere della serie XiD si distinguono per compattezza, grado scientifico ed utilizza di USB 3.0 per la connessione ad un computer. Le caratteristiche principali sono:
- Componenti di altà qualità: Sony “EXview HAD CCD II” con sensori da 2.8, 6.1, 9.1 e 12 Mpix
- Velocità di scansione: Altissima velocità utilizzando le potenzialità del 4 TAP (QuadTap)readout: 4x più veloce della GigE, 5x della Firewire e 10x della USB 2.0
- Sensibilità: Bassisimo rumore di lettura ed alta efficienza e sensibilià estesa anche nell’ IR
- Interfaccia standard per l’ industria: Connessione USB3 al computer
- Piccole dimensioni per una elevata versatilità: 60 x 60 x 39 mm, 320 grams (dati validi per la versione C-mount, senza lente e raffreddamento)
- Alimentazione: Bassi consumi pari a circa 3 Watt, alimentate da USB3.0
- Raffreddamento: Minima dissipazione di calore con raffreddamento passivo
- Compatibilità: La USB 3.0 supporta Windows 7 e 10, macOS, Linux, ARM e 30 librerie
- Software: proprietario con capacità di binning e ROI
- High grade: Sensori di alta qualità combinati con filtri anti IR appropriatamente sellezionati
- Facilità di ottimizzazione: sono disponibili numerosi accessori per personalizzare il proprio setup
- Possibilità di scelta: Disponibili in Board level e con Raffreddamento Peltier
MODELLI MONOCROMATICI ED A COLORI:
| B/W model | Color model | Sensor | Resolution | Pixel µm | ADC bits | FWC | Power Watt | DR dB | Frames per sec(1) |
| MD028MU-SY | MD028CU-SY | SONY ICX674 | 1934 x 1456, 2.8 MP | 4.54 | 8,10,12,14 | 20000 | 3.6 W | 71.1 | 57 |
|---|---|---|---|---|---|---|---|---|---|
| MD061MU-SY | MD061CU-SY | SONY ICX694 | 2754 x 2204, 6.1 MP | 4.54 | 8,10,12,14 | 19500 | 3.9 W | 71.8 | 28.4 |
| MD091MU-SY | MD091CU-SY | SONY ICX814 | 3384 x 2708, 9.1 MP | 3.69 | 8,10,12,14 | 12000 | 4.2 W | 68.4 | 20 |
| MD120MU-SY | MD120CU-SY | SONY ICX834 | 4242 x 2830, 12 MP | 3.1 | 8,10,12,14 | 10000 | 4.8 W | 63.1 | 15.3 |
(1) Maximum frame rates measured at 52 MHz, 4 taps, RAW 14 bits; +20% in overclocked mode, 12bit packed
CARATTERISTICHE COMUNI MODELLI
| Sensor technology | CCD, Global shutter |
|---|---|
| Acquisition modes | Continuous, software trigger, hardware trigger |
| Partial image readout | ROI / AOI (region/area of interest), Binning modes supported (check datasheet for details) |
| Image data formats | 8, 10, 12 or 14 bit RAW pixel data |
| SDK/API | programmable with C++ and C# |
| Color image processing* | Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS |
| Hot/blemish pixels correction* | On camera storage for bad pixels, host assisted correction |
| Auto adjustments* | Auto white balance, auto gain, auto exposure |
| Flat field corrections* | Host assisted pixel level shading and lens corrections. This feature is being developed and tested. |
| Interface | USB 3.0 standard Micro B with screw lock threads compliant to USB3 Vision standard |
| General purpose I/O | 2x opto-isolated input, 2x opto-isolated output, power LED, 2x LED software programmable |
| Signal conditioning* | Programmable debouncing time |
| Synchronization | Hardware trigger input, software trigger, exposure strobe output, busy output |
| Lens mount | Standard C mount. Available options are board level |
| Power requirements | 3 to 5.2 Watt, supplied via USB 3.0 interface or power cable |
| Dimensions | 60 x 60 x 39 mm (C-mount version) |
| Weight | 320 grams (C-mount version) |
| Environment | Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage |
| Conformity | CE, FCC, RoHS, GenICam/GenTL, USB 3.0 SuperSpeed |
| Operating systems | Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, macOS, ARM |
| Minimum host hardware | Intel i3 3.0GHz, +2GB RAM available physical memory, NVIDIA or Radeon 128MB, Motherboard with PCIe x1 Gen 2 slot, compatible USB 3.0 host adapter |
| Software support | xiAPI SDK, adapters and drivers for 30 various image processing Libraries |
| Firmware updates | Field firmware update through xiCOP |
(*) Feature is available only when the camera is in XIMEA API mode.
DOWNLOAD:
SERIE XIQ
Le telecamere della serie XiQ si distinguono per l’estrema compattezza e le dimensioni davvero ridotte (26.4 x 26.4 x 21.2 mm e solo 27 grammi di peso). La connessione al PC è USB 3.0. Le caratteristiche principali sono:
- Raffreddamento intelligente: Bassi consumi da 1.0 a 1.8 W ed una minima dissipazione
- Velocità: Alto frame rate ad elevata risoluzione: 500fps @ VGA e 90fps @ 4Mpix
- Readout: 4x più veloce della GigE, 5x della Firewire e 10x della USB 2.0
- AIA standard: USB3 Vision standard compliant
- Compatibilità: La USB 3.0 supporta Windows 7 e 10, macOS, Linux, ARM e 30 librerie
- Interfaccia standard per l’ industria: Connessione USB 3.1 al computer
- Connettività e sincronizzazione: Sono presenti input ed output isoltati otticamente
- Efficienza di costi: Eccellente rapporto qualità prezzo
- Software: Proprietario con capacità di binning e ROI – GenICam / GenTL ed altamente ottimizzati API / SDK per il processamento dell’ immagine
- Facilità di ottimizzazione: sono disponibili numerosi accessori per personalizzare il proprio setup
- Solidità di produzione: Sono in produzione regolare dal 2011
- Facilità di utilizzo: Semplice ed intuitivo software API, disponobilità di pacco C o CS o altri.
MODELLI MONOCROMATICI ED A COLORI E CON ESTENSIONE IR:
| B/W model | Color model | IR extended model (2) | Sensor | Resolution | Pixel µm | ADC bits | Frames per sec(1) | DR dB | Optical size | Power Watt |
| MQ003MG-CM | MQ003CG-CM | – | CMOSIS CMV300 | 648 x 488 | 7.4 | 12 | 500 fps | 60 | 1/3″ | 1.6 |
|---|---|---|---|---|---|---|---|---|---|---|
| MQ013MG-E2 | MQ013CG-E2 | MQ013RG-E2 | e2V EV76C560 | 1280 x 1024 | 5.3 | 10 | 60 fps | 60 | 1/1.8″ | 0.9 |
| MQ013MG-ON | MQ013CG-ON | MQ013RG-ON | ON Semiconductor PYTHON 1300 | 1280 x 1024 | 4.8 | 10 | 210 fps | 56 | 1/2″ | 1.4 |
| MQ022MG-CM | MQ022CG-CM | MQ022RG-CM | CMOSIS CMV2000 | 2048 x 1088 | 5.5 | 10 | 170 fps* | 60 | 2/3″ | 1.6 |
| MQ042MG-CM | MQ042CG-CM | MQ042RG-CM | CMOSIS CMV4000 | 2048 x 2048 | 5.5 | 10 | 90 fps* | 60 | 1″ | 1.6 |
(1) Maximum frame rates measured at 8 bits per pixel raw data in free run mode. Python 1300 model – with Zero ROT feature enabled (2) NIR model is based on EV76C661 sensor from e2V, also called Ruby and Near Infrared sensors from CMOSIS * Please check faster versions available from xiX line based on PCIe interface – special conditions may apply All models are also available in Board level version with flat ribbon flex cable or Angled connector – ideal for Embedded vision systems
CARATTERISTICHE COMUNI MODELLI
| Sensor technology | CMOS, Global shutter |
|---|---|
| Acquisition modes | Continuous, software trigger, hardware trigger |
| Partial image readout | Multiple ROI / AOI (region/area of interest), Skipping and Binning modes supported (check manual for details) |
| Image data formats | 8, 10 or 12 bit RAW pixel data |
| SDK/API | programmable with C++ and C# |
| Color image processing* | Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS, lookup table (LUT), hue, saturation, sharpness, white balance and more |
| Hot/blemish pixels correction* | On camera storage of up to 5000 pixel coordinates, host assisted correction |
| Auto adjustments* | Auto white balance, auto gain, auto exposure, HDR (High Dynamic range) |
| Flat field corrections* | Host assisted pixel level shading and lens corrections. This feature is being developed and tested |
| Interface | USB 3.0 standard Micro B with screw lock threads compliant to USB3 Vision standard |
| General purpose I/O | 1x opto-isolated input, 1x opto-isolated output, power LED, 2x LED software programmable |
| Signal conditioning* | Programmable debouncing time |
| Synchronization | Hardware and software trigger input, exposure strobe output, busy output, bulb, low smear, overlapped |
| Housing and lens mount | Standard C mount. Available options are CS mount, S-mount (M12) adapter and board level |
| Power requirements | 1 to 1.8W, supplied via USB 3.0 interface |
| Dimensions | 26.4 x 26.4 x 26.5 mm (C-mount version) |
| Weight | 27 grams (C-mount version) |
| Environment | Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage |
| Conformity | CE, FCC, RoHS, GenICam/GenTL, USB 3.0 SuperSpeed, USB3 Vision Compliant |
| Operating systems | Windows 7 SP1 (x86 and x64) and 10, Linux Ubuntu, ARM, macOS |
| Minimum host hardware | Intel i3 3.0GHz, +2GB RAM available physical memory, NVIDIA or Radeon 128MB, Motherboard with PCIe x1 Gen 2 slot, compatible USB 3.0 host adapter |
| Software support | API / SDK, adapters and drivers for various image processing Libraries |
| Firmware updates | Field firmware update through xiCOP |
(*) Feature is available only when the camera is in XIMEA API mode.
DOWNLOAD:
DPI CERTIFICATI
